Here is an exclusive webinar replay led by Vincent Auclair, featuring Vincent Pateloup, Assistant Lecturer at IRCER, discussing “Multi-Material Ceramic 3D Printing in Electronics.”
Among all the fields of application, the domain of electronic devices is the most promising. Embedding electric pathways into a ceramic part establishes a disruptive and innovative approach in this domain. Stereolithography (SLA) is a suitable process for rapidly prototyping ceramic PCBs, LTCC (Low Temperature Cofiring Ceramic), or HTCC (Hot Temperature Cofired Ceramic). This approach reduces the time and cost of development for innovative applications.