Category: The best poster video of the 26th European Microwave Week, Berlin, Germany.
🟦 Title: Comparative life cycle assessment of hybrid bonding and copper pillar die-to-wafer 3D integrations for sub-THz applications
🟨 Authors: Léa Roulleau¹, Laura Vauche¹, Olivier Valorge¹,
Christophe Dubarry¹, Léa Di Cioccio¹
¹CEA – LETI
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